Back-end process inspection solutions

The downsizing of electronic devices is challenging semiconductor manufacturers to produce smaller component sizes while maintaining tighter process control requirements. 

ISRA VISION's wafer inspection solutions for advanced wafer-level packaging ensure traceability throughout the semiconductor manufacturing process. Our systems provide superior quality control for improved device performance, enabling manufacturers to detect, resolve and monitor process deviations in a timely manner.

Re-thinning can introduce defects on the wafer's surface that can impact the performance and functionality of the final semiconductor device.

Therefore, optical inspection after re-thinning is crucial to detect defects that could impact device functionality.

Conducting optical inspection after the re-thinning process allows manufacturers to minimize the risk of defects and ensure that the final semiconductor devices meet the required performance and reliability standards. This helps to enhance the overall quality and yield of the semiconductor manufacturing process.

Dicing wafers carries the risk of defects in the dicing streets. Accurate inspection of the dicing street reliably detects these defects and minimizes the scrap rate of chips and dies. The DicingScan inspection tool provides 100% wafer inspection. High-performance line scan cameras precisely detect defects such as edge chippings in the dicing streets. In addition, the tool checks the presence, position, and completeness of the dicing streets.

With our patented MultiView imaging technology, which forms the basis of the WafQScan process, users can also inspect the rear side of the wafer through the carrier tape (foil). DicingScan ensures that only dies/chips of impeccable quality are processed.